Thermal management system and method for electronic equipment mounted on coldplates

ABSTRACT

According to an embodiment of the present invention, a thermal management system for electronic components includes a plastic coldplate having a mounting surface for mounting one or more electronic components, one or more passageways configured to have a fluid flow therethrough disposed within the plastic coldplate, and a highly conductive material disposed within the plastic coldplate and thermally coupled to the mounting surface. The highly conductive material is operable to transfer heat from the mounting surface to the fluid flow.

TECHNICAL FIELD OF THE INVENTION

This invention relates in general to thermal management of electronicequipment and, more particularly, to a thermal management system andmethod for electronic equipment mounted on coldplates.

BACKGROUND OF THE INVENTION

A trend for electronic equipment is lighter weight and lower cost.Lighter weight electronic equipment is especially important foraerospace applications, such as Active Electronically Scanned Arrays(“AESAs”). These AESAs often have significant power dissipation due tothe type of electronic components involved. To control the thermalgradients and temperature of these systems, liquid flows through thecoldplates to which they are attached may be utilized. These liquidcooled coldplates are typically formed from aluminum, which is a majorcontributor to the system weight rollup but possesses good thermalconductivity.

SUMMARY OF THE INVENTION

According to an embodiment of the present invention, a thermalmanagement system for electronic components includes a plastic coldplatehaving a mounting surface for mounting one or more electroniccomponents, one or more passageways configured to have a fluid flowtherethrough disposed within the plastic coldplate, and a highlyconductive material disposed within the plastic coldplate and thermallycoupled to the mounting surface. The highly conductive material isoperable to transfer heat from the mounting surface to the fluid flow.

According to another embodiment of the present invention, a thermalmanagement system for electronic components includes a highly conductivehousing having a mounting surface for mounting one or more electroniccomponents, a plastic coldplate disposed within the highly conductivehousing, and a highly conductive material disposed within the plasticcoldplate and thermally coupled to the mounting surface. The highlyconductive material is operable to spread the heat throughout a volumeof the plastic coldplate.

Embodiments of the invention provide a number of technical advantages.Embodiments of the invention may include all, some, or none of theseadvantages. For example, in one embodiment, forming coldplates ofplastic materials enhances thermal performance, reduces weight, andlowers cost of high power phased array systems. Different techniques areutilized to efficiently move heat from the surface of a plasticcoldplate into the cooling fluid. The techniques may be applicable toair, single phase liquid, and two phase (liquid/vapor) cooling. Some ofthe techniques of the present invention insert highly conductivematerial into the plastic coldplate to transfer the heat from thesurface of the coldplate to the cooling liquid. Other may involvemethods of efficiently transferring the heat into the cooling liquiditself.

Other technical advantages are readily apparent to one skilled in theart from the following figures, descriptions, and claims.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view of a plurality of electronic componentsmounted on a coldplate in accordance with an embodiment of theinvention;

FIGS. 2A through 2F are various views of a thermal management system forthe coldplate of FIG. 1 according to some embodiments of the presentinvention; and

FIGS. 3A and 3B are various views of a thermal management system for thecoldplate of FIG. 1 according to other embodiments of the presentinvention.

DETAILED DESCRIPTION OF THE INVENTION

Embodiments of the present invention and some of their advantages arebest understood by referring to FIGS. 1 through 3B of the drawings, likenumerals being used for like and corresponding parts of the variousdrawings.

FIG. 1 is a perspective view of a plurality of electronic components 102mounted on a coldplate 100 in accordance with one embodiment of thepresent invention. Any suitable method of coupling electronic components102 to coldplate 100 is contemplated by the present invention. In theillustrated embodiment, electronic components 102 are mounted on acircuit board 203 that is mounted on coldplate 100; however, the presentinvention contemplates electronic components 102 being directly mountedto coldplate 100. In the illustrated embodiment, electronic components102 comprise a high-powered phased array antenna system; however,electronic components 102 may comprise any suitable activeelectronically scanned array (“AESA”) or other suitable electronicsystems having any suitable function.

Coldplate 100 may be any suitable substrate for mounting electroniccomponents 102. One of the functions of coldplate 100 is to controlthermal gradients and temperatures of electronic components 102 in orderto ensure proper functioning of electronic components 102. Electroniccomponents 102 sometimes have significant power dissipation, especiallyfor phased array and other types of antenna systems. To control thethermal gradients and temperature of electronic components 102, acooling fluid may be circulated into coldplate 100 via an inlet 105. Anysuitable fluid is contemplated by the present invention, such asethylene glycol mixed with water or polyalphaolefin (“PAO”) or othersuitable fluid.

Because antenna systems, such as the one illustrated in FIG. 1, areoftentimes utilized in aerospace applications, such as militaryaircraft, low weight is often a desired criteria along with low cost ofmanufacture. However, because of the thermal considerations, the type ofmaterial a particular coldplate is formed from is important with respectto thermal conductivity.

Therefore, according to the teachings of one embodiment of the presentinvention, coldplate 100 is formed from plastic in order to keep weightdown. Any suitable polymer may be utilized for coldplate 100 and thesubsequent coldplates illustrated in FIGS. 2A through 3B. As describedin greater detail below in conjunction with FIGS. 2A through 3B, ahighly conductive material or materials are sometimes utilized alongwith a plastic coldplate to enhance the thermal management of electroniccomponents 102. A highly conductive material as used herein is amaterial having a thermal conductivity of at least 5.0 W/m*K. Forexample, a highly conductive material may be graphite, aluminum, orother suitable highly conductive material. Various embodiments ofthermal management systems using a plastic coldplate are shown anddescribed below in conjunction with FIGS. 2A through 3B.

FIGS. 2A through 2F are various views of a thermal management system forelectronic components 102 utilizing a plastic coldplate according tovarious embodiments of the present invention. Generally, the embodimentsillustrated in FIGS. 2A through 2F insert highly conductive materialinto plastic coldplates to facilitate the efficient transferring of heatfrom a surface of the coldplate to a cooling liquid.

Referring to FIG. 2A, a plastic coldplate 200 includes one or more tubes202 coupled to one or more enclosures 204. Coldplate 200 may be anysuitable size and shape and may be formed using any suitablemanufacturing method. Coldplate 200 has a mounting surface 201 formounting electronic components thereto. Tubes 202 may also have anysuitable size and shape and may be formed within coldplate 200 using anysuitable method. In a particular embodiment, tubes 202 are arrangedwithin coldplate 200 in a boustrophedonic manner; however, any suitableconfiguration of tubes 202 are contemplated by the present invention.Tubes 202 are formed from a suitable highly conductive material, such asgraphite or aluminum.

Enclosures 204 may have any suitable size and shape and are also formedfrom any suitable highly conductive material. In a particularembodiment, enclosures 204 are expanded portions of tube 202. Enclosures204 have at least a portion that coincides with mounting surface 201 ofcoldplate 200. Enclosures 204 are positioned such that they correspondto respective portions of mounting surface 201 that have the highestheat-emitting electronic components thereon. Thus, a fluid flowingthrough tubes 202 and enclosures 204 may efficiently receive the heatgenerated by these high heat-emitting electronic components to controlthe thermal gradients within coldplate 200.

Referring to FIG. 2B, a plastic coldplate 210 includes one or more tubes214 coupled to a plurality of fins 212. Coldplate 210 is also housedwithin a housing 216 having a mounting surface 217 for mountingelectronic components thereto. Coldplate 210 may be any suitable sizeand shape and may be formed using any suitable manufacturing method.Tubes 214 may also be any suitable size and shape and may be formedwithin coldplate 210 using any suitable manufacturing method. In aparticular embodiment, tubes 214 are arranged in a boustrophedonicmanner; however, tubes 214 may be arranged within coldplate 210 in anysuitable manner. Tubes 214 are formed from a suitable highly conductivematerial, such as graphite or aluminum.

Fins 212 may be any suitable size and shape and are also formed from anysuitable highly conductive material. Fins 212 may couple to tubes 214 inany suitable manner. In the illustrated embodiment, fins 212 arearranged vertically and parallel to one another; however, fins 212 mayhave any suitable arrangement. In one embodiment, fins 212 contact anupper inside surface 218 and a lower inside surface 219 of housing 216in order to efficiently transfer the heat generated by electroniccomponents on mounting surface 217 to a cooling liquid flowing throughtubes 214 during operation. In other embodiments, fins 212 do notcontact inside surface 218 and/or inside surface 219 of housing 216.

Housing 216 may be any suitable size and shape and may be formed fromany suitable highly conductive material. In one embodiment, housing 216generally conforms to the outside configuration of coldplate 210.

Referring to FIG. 2C, a waffle panel 222 is disposed within an innerhousing 223 and then disposed within a plastic coldplate 220. Coldplate220 is, in turn, disposed within an outer housing 226 having a mountingsurface 227 for mounting electronic components thereon.

Waffle panel 222 and inner housing 223 may be of any suitable shape andmay be formed from any suitable highly conductive material. Any suitablemanufacturing method may be utilized to manufacture waffle panel 222 andinner housing 223. In one embodiment, inner housing 223 includes aplurality of projections 224 that couple to an inside surface 229 ofouter housing 226 in order to efficiently transfer heat from mountingsurface 227 down into inner housing 223 in order to contact fluidflowing through waffle panel 222 during operation. In one embodiment,projections 224 are positioned such that they correspond to respectiveportions 228 of mounting surface 227 that have the highest heat-emittingelectronic components thereon.

Coldplate 220 may have any suitable size and shape and may be formedusing any suitable manufacturing method. Outer housing 226 may also haveany suitable size and shape and generally conforms to the outsideconfiguration of coldplate 220. Outer housing 226 may be formed from anysuitable highly conductive material.

Referring to FIG. 2D, a plastic coldplate 230 includes a waffle panel232 disposed therein. Waffle panel 232 is similar to waffle panel 222 ofFIG. 2C and, hence, may be of any suitable shape and may be formed fromany suitable highly conductive material using any suitable manufacturingmethod. In one embodiment, waffle panel 232 contacts an inside surface233 of coldplate 230 in order to efficiently transfer heat from mountingsurface 231 throughout the interior of coldplate 230. Waffle panel 232may also contact the other inside surfaces of coldplate 230 in otherembodiments of the invention.

Coldplate 230 may have any suitable size and shape and may be formedusing any suitable manufacturing method. Coldplate 230 includes amounting surface 231 for mounting electronic components thereto.

Referring to FIG. 2E, a plastic coldplate 240 includes a plurality ofpassageways 246 formed therein. Coldplate 240, in the illustratedembodiment, is disposed within a housing 242 having a mounting surface243 for mounting electronic components thereto. Housing 242 may beformed from any suitable highly conductive material.

Coldplate 240 may have any suitable size and shape and may be formedusing any suitable manufacturing method. In a particular embodiment,coldplate 240 is formed from a top half 247 and a bottom half 248 inorder to facilitate passageways 246 being separate from one another.Separate flowpaths (not illustrated) may be associated with eachpassageway 246 for a cooling liquid.

Housing 242 may have a plurality of protrusions 244 extending from anupper inside surface 241 and a lower inside surface 249. Protrusions244, in one embodiment, extend between adjacent passageways 246 in orderto efficiently transfer heat from mounting surface 243 to a fluidflowing through each passageway 246. Protrusions 244 may have anysuitable size and shape and may extend down into coldplate 240 anysuitable distance. In other embodiments, protrusions 244 do not exist.

Referring to FIG. 2F, a plastic coldplate 310 includes a plurality ofvertical posts 314 disposed therein. Coldplate 310 is also disposedwithin a housing 312 having a mounting surface 313 for mountingelectronic components thereto. Housing 312 may have any suitable sizeand shape and may be formed from any suitable highly conductivematerial.

Coldplate 310 may be of any suitable size and shape and may be formedusing any suitable manufacturing method. Vertical posts 314 may have anysuitable size and shape and may be formed from any suitable highlyconductive material. In the illustrated embodiment, vertical posts 314couple to an upper inside surface 315 and a lower inside surface 316 ofhousing 312. In other embodiments, vertical posts 314 do not couple toupper inside surface 315 and/or lower inside surface 316. Vertical posts314 may have any suitable arrangement and function to efficientlytransfer heat emanating from electric components mounted on mountingsurface 313 to a fluid flowing through coldplate 310.

FIGS. 3A and 3B are various views of a thermal management system forelectronic components 102 utilizing a plastic coldplate according toother embodiments of the present invention. The embodiments illustratedin FIGS. 3A and 3B may utilize highly conductive material to efficientlyspread the heat from electronic components throughout a volume of theplastic coldplate.

Referring to FIG. 3A, a plastic coldplate 300 includes a plurality offins 304 coupled to a plurality of heat pipes 306. Coldplate 300 is alsodisposed within a housing 302 having a mounting surface 303 for mountingelectronic components thereto. Housing 302 may be any suitable size andshape and may be formed from any suitable highly conductive material.

Coldplate 300 may be of any suitable size and shape and may be formedusing any suitable manufacturing method. Fins 304 and heat pipes 306 areformed from any suitable highly conductive material and may be disposedwithin coldplate 300 in any suitable manner. In the illustratedembodiment, fins 304 and heat pipes 306 form a grid-like structure;however, the present invention contemplates any suitable arrangement forfins 304 and heat pipes 306. Fins 304 are illustrated in FIG. 3A asbeing vertically disposed and parallel to one another; however, fins 304may have other configurations. In the illustrated embodiment, fins 304contact an upper inside surface 307 and a lower inside surface 308 ofhousing 302. In other embodiments, fins 304 do not directly couple toupper inside surface 307 and/or lower inside surface 308. Heat pipes 306may be any suitable heat pipes having any suitable configuration.

Referring to FIG. 3B, a plastic coldplate 320 includes a plurality ofvertical posts 324 and a plurality of horizontal fins 326. Coldplate 320is also disposed within a housing 322 having a mounting surface 323 formounting electronic components thereto. Housing 322 may have anysuitable size and shape and may be formed from any suitable highlyconductive material.

Coldplate 320 may have any suitable size and shape and may be formedusing any suitable manufacturing method. Vertical posts 324 are similarto vertical posts 314 of FIG. 2F and, hence, vertical posts 324 maycouple to one or the other (or both) of an upper inside surface 327 or alower inside surface 328 of housing 322. Horizontal fins 326 couple tovertical posts 324 and may be any suitable size and shape and may beformed from any suitable highly conductive material. In the illustratedembodiment, horizontal fins 326 are parallel spaced apart fins thatcouple to each vertical post 324. However, horizontal fins 326 may haveany suitable arrangement. Horizontal fins 326 help facilitate efficientspreading of heat throughout a volume of coldplate 320.

Thus, various embodiments of a thermal management system utilizing aplastic coldplate are illustrated in FIGS. 2A through 3B to efficientlycontrol thermal gradients and temperatures within a particularcoldplate. The plastic coldplates of the present invention helpfacilitate low weight and low cost for high-powered phased array antennasystems and other suitable electronic systems, which is especiallyimportant for aerospace applications. In addition, the thermalperformance of plastic coldplates is enhanced by, in some embodiments,adding highly conductive material thereto as shown above in some of theembodiments in FIGS. 2A through 3B.

Although embodiments of the invention and some of their advantages aredescribed in detail, a person skilled in the art could make variousalterations, additions, and omissions without departing from the spiritand scope of the present invention as defined by the appended claims.

1. A thermal management system for electronic components, comprising: aplastic coldplate having a mounting surface for mounting one or moreelectronic components; one or more passageways disposed within theplastic coldplate, the passageways configured to have a fluid flowtherethrough in such a manner that the fluid flow does not physicallyengage the plastic coldplate; and a highly conductive material disposedwithin the plastic coldplate and thermally coupled to the mountingsurface, the highly conductive material operable to transfer heat fromthe mounting surface to the fluid flow.
 2. The system of claim 1,wherein the electronic components comprise an Active ElectronicallyScanned Array.
 3. The system of claim 1, further comprising a circuitboard for mounting the one or more electronic components, the circuitboard coupled to the mounting surface.
 4. The system of claim 1, whereinthe highly conductive material comprises a waffle panel.
 5. The systemof claim 4, wherein the waffle panel is disposed within a housing, thehousing having one or more projections engaged with respective sectionsof the mounting surface.
 6. The system of claim 1, wherein the plasticcoldplate is formed from two separate pieces and the passageways areseparated from one another.
 7. The system of claim 6, wherein the highlyconductive material comprises a plurality of protrusions extendingbetween adjacent passageways.
 8. The system of claim 1, wherein the oneor more passageways comprises a tube disposed within the plasticcoldplate in a boustrophedonic manner and wherein the highly conductivematerial comprises a plurality of fins coupled to the tube.
 9. Thesystem of claim 1, wherein the one or more passageways comprise one ormore tubes disposed within the plastic coldplate and wherein the highlyconductive material comprises one or more enclosures coupled to thetubes in series.
 10. The system of claim 1, wherein the plasticcoldplate is housed within a highly conductive housing, the mountingsurface associated with the housing.
 11. A thermal management method forelectronic components, comprising: mounting one or more electroniccomponents on a mounting surface of a plastic coldplate, the plasticcoldplate having one or more passageways disposed therein that areconfigured to have a fluid flow therethrough in such a manner that thefluid flow does not physically engage the plastic coldplate; disposing ahighly conductive material within the plastic coldplate; and thermallycoupling the highly conductive material to the mounting surface totransfer heat from the mounting surface to the fluid flow duringoperation of the electronic components.
 12. The method of claim 11,wherein the electronic components comprise an Active ElectronicallyScanned Array.
 13. The method of claim 11, wherein mounting the one ormore electronic components on the mounting surface of the plasticcoldplate comprises mounting the one or more electronic components on acircuit board and mounting the circuit board to the mounting surface.14. The method of claim 11, wherein thermally coupling the highlyconductive material to the mounting surface comprises disposing a wafflepanel within a housing and engaging one or more projections of thehousing with respective portions of the mounting surface.
 15. The methodof claim 11, further comprising separating the passageways from oneanother.
 16. The method of claim 11, wherein the one or more passagewayscomprises a tube disposed within the plastic coldplate in aboustrophedonic manner and wherein the highly conductive materialcomprises a plurality of fins coupled to the tube.
 17. The method ofclaim 11, further comprising housing the plastic coldplate within ahighly conductive housing, the mounting surface associated with thehousing.